The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 2013
Filed:
Dec. 21, 2009
Applicants:
Anthony Mowry, Buda, TX (US);
David Farber, Austin, TX (US);
Fred Hause, Austin, TX (US);
Markus Lenski, Dresden, DE;
Inventors:
Anthony Mowry, Buda, TX (US);
David Farber, Austin, TX (US);
Fred Hause, Austin, TX (US);
Markus Lenski, Dresden, DE;
Assignee:
GLOBALFOUNDRIES Inc., Grand Cayman, KY;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/36 (2006.01); H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
By providing heat dissipation elements or heat pipes in temperature critical areas of a semiconductor device, enhanced performance, reliability and packing density may be achieved. The heat dissipation elements may be formed on the basis of standard manufacturing techniques and may be positioned in close proximity to individual transistor elements and/or may be used for shielding particular circuit portions.