The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 15, 2013

Filed:

Sep. 23, 2011
Applicants:

Tokunobu Akao, Toyama, JP;

Unryu Ogawa, Toyama, JP;

Masahisa Okuno, Toyama, JP;

Shinji Yashima, Toyama, JP;

Atsushi Umekawa, Toyama, JP;

Kaichiro Minami, Toyama, JP;

Inventors:

Tokunobu Akao, Toyama, JP;

Unryu Ogawa, Toyama, JP;

Masahisa Okuno, Toyama, JP;

Shinji Yashima, Toyama, JP;

Atsushi Umekawa, Toyama, JP;

Kaichiro Minami, Toyama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/324 (2006.01); H01L 21/42 (2006.01); H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract

A substrate processing apparatus includes a processing chamber configured to process a substrate having a front surface including a dielectric, a substrate support member provided within the processing chamber to support the substrate, a microwave supplying unit configured to supply a microwave to a front surface side of the substrate supported on the substrate support member; and a conductive substrate cooling unit which is provided at a rear surface side of the substrate supported on the substrate support member and has an opposing surface facing the rear surface of the substrate. A distance between the top of the substrate support member and the opposing surface of the substrate cooling unit corresponds to an odd multiple of ¼ wavelength of the microwave supplied when the substrate is processed.


Find Patent Forward Citations

Loading…