The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 2013
Filed:
Apr. 13, 2012
Yoichi Sengoku, Amagasaki, JP;
Masami Tsutae, Amagasaki, JP;
Kiyoto Tai, Amagasaki, JP;
Keisuke Joko, Amagasaki, JP;
Tsuyoshi Amatani, Amagasaki, JP;
Yoichi Sengoku, Amagasaki, JP;
Masami Tsutae, Amagasaki, JP;
Kiyoto Tai, Amagasaki, JP;
Keisuke Joko, Amagasaki, JP;
Tsuyoshi Amatani, Amagasaki, JP;
Mec Company, Amagasaki-Shi, Hyogo, JP;
Abstract
Provided are: a coating-forming liquid composition capable of forming a coating for bonding copper to a photosensitive resin, which includes an aqueous solution containing an azole having only nitrogen as ring hetero atom, an acid having a logarithm of the reciprocal of acid dissociation constant of 3 to 8 at 25° C., and a salt thereof, has a pH of more than 4 and not more than 7 at 25° C., and can stably form a coating for improving adhesion between copper and a photosensitive resin even when used continuously or repeatedly; and a method of forming a coating for bonding copper to a photosensitive resin, which comprises bringing the surface of the copper into contact with the coating-forming liquid composition to form the coating.