The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 08, 2013
Filed:
May. 22, 2009
Jinhong Tong, Santa Clara, CA (US);
Zhi-wen Sun, San Jose, CA (US);
Chi-i Lang, Sunnyvale, CA (US);
Nitin Kumar, Menlo Park, CA (US);
Bob Kong, San Jose, CA (US);
Zachary Fresco, Santa Clara, CA (US);
Jinhong Tong, Santa Clara, CA (US);
Zhi-Wen Sun, San Jose, CA (US);
Chi-I Lang, Sunnyvale, CA (US);
Nitin Kumar, Menlo Park, CA (US);
Bob Kong, San Jose, CA (US);
Zachary Fresco, Santa Clara, CA (US);
Intermolecular, Inc., San Jose, CA (US);
Abstract
Methods for improving selective deposition of a capping layer on a patterned substrate are presented, the method including: receiving the patterned substrate, the patterned substrate including a conductive region and a dielectric region; forming a molecular masking layer (MML) on the dielectric region; preparing an electroless (ELESS) plating bath, where the ELESS plating bath includes: a cobalt (Co) ion source: a complexing agent: a buffer: a tungsten (W) ion source: and a reducing agent; and reacting the patterned substrate with the ELESS plating bath for an ELESS period at an ELESS temperature and an ELESS pH so that the capping layer is selectively formed on the conductive region. In some embodiments, methods further include a pH adjuster for adjusting the ELESS pH to a range of approximately 9.0 pH to 9.2 pH. In some embodiments, the pH adjuster is tetramethylammonium hydroxide (TMAH). In some embodiments, the MML is hydrophilic.