The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 01, 2013
Filed:
Jun. 13, 2012
Carsten Von Koblinski, Bodensdorf, AT;
Gerald Lackner, Arnoldstein, AT;
Karin Schrettlinger, Trebesing, AT;
Markus Ottowitz, Arnoldstein, AT;
Carsten Von Koblinski, Bodensdorf, AT;
Gerald Lackner, Arnoldstein, AT;
Karin Schrettlinger, Trebesing, AT;
Markus Ottowitz, Arnoldstein, AT;
Infineon Technologies Austria AG, Villach, AT;
Abstract
A method for manufacturing semiconductor devices is disclosed. A semiconductor wafer is provided having a first surface and a second surface opposite to the first surface. A first glass substrate is provided which has at least one of cavities and openings at the bonding surface. The first glass substrate is bonded to the first surface of the semiconductor wafer such that the metal pads are arranged within respective cavities or openings of the first glass substrate. The second surface of the semiconductor wafer is machined. At least one metallisation region is formed on the machined second surface of the semiconductor wafer.