The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 01, 2013
Filed:
Sep. 28, 2011
Juan A. Herbsommer, Schnecksville, PA (US);
Osvaldo J. Lopez, Annandale, NJ (US);
Jonathan A. Noquil, Bethlehem, PA (US);
David Jauregui, Bethlehem, PA (US);
Mark E. Granahan, Allentown, PA (US);
Juan A. Herbsommer, Schnecksville, PA (US);
Osvaldo J. Lopez, Annandale, NJ (US);
Jonathan A. Noquil, Bethlehem, PA (US);
David Jauregui, Bethlehem, PA (US);
Mark E. Granahan, Allentown, PA (US);
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
A packaged power supply module () comprising a chip () with a first power field effect transistor (FET) and a second chip () with a second FET conductively attached side-by-side onto a conductive carrier (), the transistors having bond pads of a first area () and the carrier having bond pads of a second area () smaller than the first area. Conductive bumps () attached to the transistor bond pads and conductive bumps () attached to the carrier bond pads have equal volume and are coplanar (), the bumps on the transistor pads having a first height and the bumps on the carrier pads having a second height greater than the first height.