The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 01, 2013
Filed:
Nov. 24, 2010
Paul Lukas Brillhart, Pleasanton, CA (US);
Richard Fovell, San Jose, CA (US);
Douglas A. Buchberger, Jr., Livermore, CA (US);
Douglas H. Burns, Saratoga, CA (US);
Kallol Bera, San Jose, CA (US);
Daniel J. Hoffman, Saratoga, CA (US);
Kenneth W. Cowans, Fullerton, CA (US);
William W. Cowans, Fullerton, CA (US);
Glenn W. Zubillaga, Canyon Lake, CA (US);
Isaac Millan, Anaheim, CA (US);
Paul Lukas Brillhart, Pleasanton, CA (US);
Richard Fovell, San Jose, CA (US);
Douglas A. Buchberger, Jr., Livermore, CA (US);
Douglas H. Burns, Saratoga, CA (US);
Kallol Bera, San Jose, CA (US);
Daniel J. Hoffman, Saratoga, CA (US);
Kenneth W. Cowans, Fullerton, CA (US);
William W. Cowans, Fullerton, CA (US);
Glenn W. Zubillaga, Canyon Lake, CA (US);
Isaac Millan, Anaheim, CA (US);
B/E Aerospace, Inc., Wellington, FL (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
A method of controlling wafer temperature in a plasma reactor by obtaining the next scheduled change in RF heat load on the workpiece, and using thermal modeling to estimate respective changes in wafer backside gas pressure and in coolant flow through a wafer support pedestal that would compensate for the next scheduled change in RF heat load, and making the respective changes in the backside gas pressure or in the coolant flow prior to the time of the next scheduled change.