The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 01, 2013
Filed:
Feb. 17, 2012
Ken Nakao, Nirasaki, JP;
Muneo Harada, Nirasaki, JP;
Itaru Iida, Nirasaki, JP;
Eiji Yamaguchi, Nirasaki, JP;
Ken Nakao, Nirasaki, JP;
Muneo Harada, Nirasaki, JP;
Itaru Iida, Nirasaki, JP;
Eiji Yamaguchi, Nirasaki, JP;
Tokyo Electron Limited, Tokyo, JP;
Abstract
Provided is a method for manufacturing a semiconductor device which includes: providing a plurality of semiconductor substrates formed with through holes which penetrate between main surfaces of the substrates and are filled with porous conductors; stacking the plurality of semiconductor substrates while aligning the porous conductors filled in the through holes; introducing conductive ink containing particle-like conductors into the porous conductors of the plurality of stacked semiconductor substrates; and sintering the plurality of stacked semiconductor substrates.