The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 2013
Filed:
Nov. 10, 2010
Jin Seong Kim, Seoul, KR;
Dong Joo Park, Incheon, KR;
Kwang Ho Kim, Kyunggi-do, KR;
YE Sul Ahn, Seoul, KR;
Jin Seong Kim, Seoul, KR;
Dong Joo Park, Incheon, KR;
Kwang Ho Kim, Kyunggi-do, KR;
Ye Sul Ahn, Seoul, KR;
Amkor Technology, Inc., Chandler, AZ (US);
Abstract
Disclosed are a semiconductor device capable of efficiently radiating heat of a semiconductor die and a method of fabricating the same. The semiconductor device efficiently radiates the heat by preventing an encapsulant from reaching the semiconductor die by an encapsulant dam so that an upper surface of the semiconductor die is exposed out of the encapsulant. In addition, the semiconductor device is configured to expose a pre-solder ball or a conductive pattern of a substrate through a via of the encapsulant. Therefore, electrical connection between the pre-solder ball and a solder ball of another semiconductor device stacked thereon is easily achieved.