The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2013

Filed:

Feb. 26, 2010
Applicants:

Lee-wee Teo, Singapore, SG;

Ming Zhu, Singapore, SG;

Chi-ju Lee, Gurien Township, TW;

Sheng-chen Chung, Jhubei, TW;

Kai-shyang You, Jhubei, TW;

Harry-hak-lay Chuang, Hsinchu, TW;

Inventors:

Lee-Wee Teo, Singapore, SG;

Ming Zhu, Singapore, SG;

Chi-Ju Lee, Gurien Township, TW;

Sheng-Chen Chung, Jhubei, TW;

Kai-Shyang You, Jhubei, TW;

Harry-Hak-Lay Chuang, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/70 (2006.01);
U.S. Cl.
CPC ...
Abstract

The methods and structures described are used to prevent protrusion of contact metal (such as W) horizontally into gate stacks of neighboring devices to affect the work functions of these neighboring devices. The metal gate under contact plugs that are adjacent to devices and share the (or are connected to) metal gate is defined and lined with a work function layer that has good step coverage to prevent contact metal from extruding into gate stacks of neighboring devices. Only modification to the mask layout for the photomask(s) used for removing dummy polysilicon is involved. No additional lithographical operation or mask is needed. Therefore, no modification to the manufacturing processes or additional substrate processing steps (or operations) is involved or required. The benefits of using the methods and structures described above may include increased device yield and performance.


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