The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 2013
Filed:
Mar. 12, 2007
Chongying Xu, New Milford, CT (US);
Bryan C. Hendrix, Danbury, CT (US);
Thomas M. Cameron, Newtown, CT (US);
Jeffrey F. Roeder, Brookfield, CT (US);
Matthias Stender, New Milford, CT (US);
Tianniu Chen, Rocky Hill, CT (US);
Chongying Xu, New Milford, CT (US);
Bryan C. Hendrix, Danbury, CT (US);
Thomas M. Cameron, Newtown, CT (US);
Jeffrey F. Roeder, Brookfield, CT (US);
Matthias Stender, New Milford, CT (US);
Tianniu Chen, Rocky Hill, CT (US);
Advanced Technology Materials, Inc., Danbury, CT (US);
Abstract
Precursor compositions useful for atomic layer deposition (ALD) and chemical vapor deposition (CVD) of strontium ruthenium oxide (SrRuO) thin films, e.g., in the manufacture of microelectronic devices, as well as processes of making and using such precursors, and precursor supply systems containing such precursor compositions in packaged form. Cyclopentadienyl compounds of varied type are described, including cyclopentadienyl as well as non cyclopentadienyl ligands coordinated to ruthenium, strontium or barium central atoms. The precursors of the invention are useful for forming contacts for microelectronic memory device structures, and in a specific aspect for selectively coating copper metallization without deposition on associated dielectric, under deposition conditions in a forming gas ambient.