The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 27, 2013

Filed:

Jul. 03, 2007
Applicants:

Takayuki Naba, Kanagawa-ken, JP;

Michiyasu Komatsu, Kanagawa-ken, JP;

Noritaka Nakayama, Kanagawa-ken, JP;

Hiromasa Kato, Kanagawa-ken, JP;

Inventors:

Takayuki Naba, Kanagawa-ken, JP;

Michiyasu Komatsu, Kanagawa-ken, JP;

Noritaka Nakayama, Kanagawa-ken, JP;

Hiromasa Kato, Kanagawa-ken, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); B32B 15/00 (2006.01); B32B 15/04 (2006.01); B32B 15/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

A ceramic-metal composite includes a ceramic substrate, an active metal brazing alloy layer, and a metal plate bonded to the ceramic substrate through the active metal brazing alloy layer disposed therebetween. The active metal brazing alloy layer contains a transition metal that is at least one element selected from Group-8 elements specified in the periodic table. According to the above configuration, the following composite and device can be provided: the ceramic-metal composite that exhibits high bonding strength, heat cycle resistance, durability, and reliability even if the ceramic-metal composite is used in a power module and a semiconductor device including the ceramic-metal composite.


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