The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8518127 B1

PDF
Full Text
Expired
Date of Patent:
Aug. 27, 2013

Filed:

Jul. 05, 2011
Applicants:

Wei-chih Lee, New Taipei, TW;

Ming-tsung Chen, Hsinchu, TW;

Inventors:

Wei-Chih Lee, New Taipei, TW;

Ming-Tsung Chen, Hsinchu, TW;

Assignees:

INPAQ Technology Co., Ltd., Miaoli County, TW;

APAQ Technology Co., Ltd., Miaoli County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 9/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A manufacturing method of solid capacitors includes the following steps. First step is forming a plurality of separated adhesive layer on an insulating substrate. Next step is disposing valve-metal wires on the adhesive layers. Next step is forming a conductive layer on the adhesive layer and the valve-metal wires. Next step is forming a dielectric structure on the exposed surface of the valve-metal wires and the conductive layer. Next step is forming a hydrophobic layer and a conductive unit. Next step is separating the formed structures as individual capacitors. Next step is packaging the formed structures and forming terminals connected to the formed structures.


Find Patent Forward Citations

Lee, Wei-Chih. (2013). Solid capacitor and manufacturing method thereof (U.S. Patent No. 8518127). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8518127

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