The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 20, 2013
Filed:
Apr. 27, 2011
Katsuhiko Hotta, Kanagawa, JP;
Takeshi Furusawa, Kanagawa, JP;
Toshikazu Matsui, Kanagawa, JP;
Takuro Homma, Kanagawa, JP;
Katsuhiko Hotta, Kanagawa, JP;
Takeshi Furusawa, Kanagawa, JP;
Toshikazu Matsui, Kanagawa, JP;
Takuro Homma, Kanagawa, JP;
Renesas Electronics Corporation, Kawasaki-shi, JP;
Abstract
Provided is a technique capable of improving the reliability of a semiconductor device having a slit made over a main surface of a semiconductor substrate, so as to surround each element formation region. In the technique, a second passivation film covers the side surface of an opening made to make the upper surface of a sixth-layer interconnection Mused for bonding pads naked, and the inner walls (the side surfaces and the bottom surface) of a slit made to surround the circumference of a guard ring and made in a first passivation film, an insulating film for bonding, and an interlayer dielectric, so as to cause the bottom thereof not to penetrate through a barrier insulating film.