The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 20, 2013
Filed:
Mar. 18, 2010
Jun LU, San Jose, CA (US);
Ming Sun, Sunnyvale, CA (US);
Yueh-se Ho, Sunnyvale, CA (US);
Kai Liu, Mountain View, CA (US);
Lei Shi, Shanghai, CN;
Jun Lu, San Jose, CA (US);
Ming Sun, Sunnyvale, CA (US);
Yueh-Se Ho, Sunnyvale, CA (US);
Kai Liu, Mountain View, CA (US);
Lei Shi, Shanghai, CN;
Alpha & Omega Semiconductor Incorporated, Sunnyvale, CA (US);
Abstract
The present invention features a lead-frame package, having a first, second, third and fourth electrically conductive structures with a pair of semiconductor dies disposed therebetween defining a stacked structure. The first and second structures are spaced-apart from and in superimposition with the first structure. A semiconductor die is disposed between the first and second structures. The semiconductor die has contacts electrically connected to the first and second structures. A part of the third structure lies in a common plane with a portion of the second structure. The third structure is coupled to the semiconductor die. An additional semiconductor die is attached to one of the first and second structures. The fourth structure is in electrical contact with the additional semiconductor die. A molding compound is disposed to encapsulate a portion of said package with a sub-portion of the molding compound being disposed in the volume.