The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 13, 2013
Filed:
Nov. 18, 2008
Hiroshi Wakaba, Yokohama, JP;
Yoshinori Hayashi, Yokohama, JP;
Koichi Miyazono, Yokohama, JP;
Yoko Ono, Yokohama, JP;
Hideki Mori, Yokohama, JP;
Shozo Kawasaki, Yokohama, JP;
Hiroshi Wakaba, Yokohama, JP;
Yoshinori Hayashi, Yokohama, JP;
Koichi Miyazono, Yokohama, JP;
Yoko Ono, Yokohama, JP;
Hideki Mori, Yokohama, JP;
Shozo Kawasaki, Yokohama, JP;
Shibaura Mechatronics Corporation, Yokohama-shi, JP;
Abstract
A substrate surface inspection apparatus and method enabling judgment and analysis of the state of even portions of a substrate supported by supports using a captured image are provided. A support mechanismis used where positions of arrangement of substrate support positions along the direction perpendicular to a scan direction by a plurality of first supportstoare set outside the image capturing ranges of the substrateby the imaging unitsat the first relative position and inside the common image capturing range and where positions of arrangement of substrate support positions along the direction perpendicular to the scan direction by the plurality of second supportstoare set outside the image capturing ranges of the substrate by the imaging units at the second relative position and inside the common image capturing range. The surface of the substratesupported by the plurality of first supports is scanned and captured by the imaging units at the first relative position, the imaging units are moved to the second relative position, then the surface of the substratesupported by the plurality of second supports is scanned and captured by the imaging units at the second relative position.