The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 13, 2013
Filed:
May. 02, 2011
Applicants:
Yung-chin Hou, Taipei, TW;
Shyue-shyh Lin, Zhubei, TW;
Li-chun Tien, Tainan, TW;
Shu-min Chen, Yongkang, TW;
Pin-dai Sue, Tainan, TW;
Inventors:
Yung-Chin Hou, Taipei, TW;
Shyue-Shyh Lin, Zhubei, TW;
Li-Chun Tien, Tainan, TW;
Shu-Min Chen, Yongkang, TW;
Pin-Dai Sue, Tainan, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 21/768 (2006.01); H01L 29/41 (2006.01);
U.S. Cl.
CPC ...
Abstract
A circuit includes a semiconductor substrate; a bottom metal layer over the semiconductor substrate, wherein no additional metal layer is between the semiconductor substrate and the bottom metal layer; and a cell including a plug-level power rail under the bottom metal layer.