The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 06, 2013
Filed:
Dec. 30, 2008
Takayuki Kobayashi, Tokyo, JP;
Tsutomu Sasaki, Tokyo, JP;
Masamoto Tanaka, Tokyo, JP;
Katsuichi Kimura, Iruma, JP;
Takayuki Kobayashi, Tokyo, JP;
Tsutomu Sasaki, Tokyo, JP;
Masamoto Tanaka, Tokyo, JP;
Katsuichi Kimura, Iruma, JP;
Nippon Steel & Sumikin Materials Co., Ltd., Tokyo, JP;
Nippon Micrometal Corporation, Saitama, JP;
Abstract
To provide a solder alloy, a solder ball and an electronic member having a solder bump, used for connection with a mother board or the like, having a melting temperature of less than 250° C. for the solder alloy, achieving high drop impact resistance required in mobile devices or the like. A solder alloy is used which consists of not less than 0.1 mass ppm of boron and not greater than 200 mass ppm of boron and a remainder comprising substantially not less than 40% by mass of Sn, in which its melting temperature is less than 250° C.