The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 30, 2013
Filed:
Oct. 29, 2010
James P. Cruse, Santa Cruz, CA (US);
Dermot Cantwell, Sunnyvale, CA (US);
Ming Xu, San Jose, CA (US);
Charles Hardy, San Jose, CA (US);
Benjamin Schwarz, San Jose, CA (US);
Kenneth S. Collins, San Jose, CA (US);
Andrew Nguyen, San Jose, CA (US);
Zhifeng Sui, Fremont, CA (US);
Evans Lee, Milpitas, CA (US);
James P. Cruse, Santa Cruz, CA (US);
Dermot Cantwell, Sunnyvale, CA (US);
Ming Xu, San Jose, CA (US);
Charles Hardy, San Jose, CA (US);
Benjamin Schwarz, San Jose, CA (US);
Kenneth S. Collins, San Jose, CA (US);
Andrew Nguyen, San Jose, CA (US);
Zhifeng Sui, Fremont, CA (US);
Evans Lee, Milpitas, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
Methods for processing substrates in twin chamber processing systems having first and second process chambers and shared processing resources are provided herein. In some embodiments, a method may include flowing a process gas from a shared gas panel to a processing volume of the first process chamber and to a processing volume of the second process chamber; forming a first plasma in the first processing volume to process the first substrate and a second plasma to process the second substrate; monitoring the first processing volume and the second processing volume to determine if a process endpoint is reached in either volume; and either terminating the first and second plasma simultaneously when a first endpoint is reached; or terminating the first plasma when a first endpoint is reached in the first processing volume while continuing to provide the second plasma in the second processing volume until a second endpoint is reached.