The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 2013
Filed:
Jun. 01, 2010
Hsiao-tsung Yen, Tainan, TW;
Chin-wei Kuo, Zhubei, TW;
Hsien-pin HU, Zhubei, TW;
Sally Liu, Hsin-Chu, TW;
Ming-fa Chen, Taichung, TW;
Jhe-ching LU, Tainan, TW;
Hsiao-Tsung Yen, Tainan, TW;
Chin-Wei Kuo, Zhubei, TW;
Hsien-Pin Hu, Zhubei, TW;
Sally Liu, Hsin-Chu, TW;
Ming-Fa Chen, Taichung, TW;
Jhe-Ching Lu, Tainan, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
In accordance with an embodiment, a semiconductor device comprises a semiconductor die, an interposer, and conductive bumps bonding the semiconductor die to the interposer. The semiconductor die comprises a first metallization layer, and the first metallization layer comprises a first conductive pattern. The interposer comprises a second metallization layer, and the second metallization layer comprises a second conductive pattern. Some of the conductive bumps electrically couple the first conductive pattern to the second conductive pattern to form a coil. Other embodiments contemplate other configurations of coils, inductors, and/or transformers, and contemplate methods of manufacture.