The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 11, 2013
Filed:
Apr. 14, 2006
Applicants:
Akinori Etoh, Ichihara, JP;
Setsuko Oike, Sodegaura, JP;
Tomokazu Ishizuka, Ichihara, JP;
Shigeharu Fujii, Ichihara, JP;
Kiyotaka Shindo, Otake, JP;
Inventors:
Akinori Etoh, Ichihara, JP;
Setsuko Oike, Sodegaura, JP;
Tomokazu Ishizuka, Ichihara, JP;
Shigeharu Fujii, Ichihara, JP;
Kiyotaka Shindo, Otake, JP;
Assignee:
Mitsui Chemicals, Inc., Minato-Ku, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24D 3/28 (2006.01); B24D 3/344 (2006.01); C09G 1/16 (2006.01); D21H 17/375 (2006.01); A61K 47/48176 (2006.01);
U.S. Cl.
CPC ...
Abstract
Disclosed is a polishing slurry which enables to suppress damages to an under layer while securing an adequate polishing rate. The polishing slurry contains a resin (A) having an amide group and an organic resin (B).
Etoh, Akinori. (2013). Polishing slurry and polishing material using same (U.S. Patent No. 8460414). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8460414
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