The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 07, 2013
Filed:
Jan. 27, 2012
David Malcolm Camm, Vancouver, CA;
Guillaume Sempere, Vancouver, CA;
Ljubomir Kaludjercic, Vancouver, CA;
Gregory Stuart, Burnaby, CA;
Mladen Bumbulovic, Vancouver, CA;
Tim Tran, Surrey, CA;
Sergiy Dets, Burnaby, CA;
Tony Komasa, Vancouver, CA;
Marc Rudolph, Vancouver, CA;
Joseph Cibere, Burnaby, CA;
David Malcolm Camm, Vancouver, CA;
Guillaume Sempere, Vancouver, CA;
Ljubomir Kaludjercic, Vancouver, CA;
Gregory Stuart, Burnaby, CA;
Mladen Bumbulovic, Vancouver, CA;
Tim Tran, Surrey, CA;
Sergiy Dets, Burnaby, CA;
Tony Komasa, Vancouver, CA;
Marc Rudolph, Vancouver, CA;
Joseph Cibere, Burnaby, CA;
Mattson Technology, Inc., Fremont, CA (US);
Abstract
An apparatus for supporting a semiconductor workpiece includes a heating system configured to cause thermally-induced motion of the semiconductor workpiece by heating a surface of the workpiece relative to a bulk of the workpiece. The thermally-induced motion includes vertical motion of an outer edge region of the workpiece and a center of the workpiece relative to each other. The apparatus further includes a support system configured to allow the thermally-induced motion including the vertical motion of the outer edge region of the workpiece and the center of the workpiece relative to each other while supporting the workpiece.