The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 30, 2013
Filed:
Apr. 11, 2012
Takashi Katayama, Kurashiki, JP;
Tetsuya Watanabe, Osaka, JP;
Yukio Goto, Toyonaka, JP;
Shinya Kato, Kurashiki, JP;
Toshiyasu Yajima, Shinagawa-ku, JP;
Takashi Katayama, Kurashiki, JP;
Tetsuya Watanabe, Osaka, JP;
Yukio Goto, Toyonaka, JP;
Shinya Kato, Kurashiki, JP;
Toshiyasu Yajima, Shinagawa-ku, JP;
Kuraray Co., Ltd., Kurashiki-shi, JP;
Maruishi Sangyo Co., Ltd., Tokyo, JP;
Abstract
To provide a polishing pad () useful for polishing semiconductor materials having a high hardness. The polishing pad () is used for polishing a workpiece () in combination with loose grains and comprises a polishing surface () comprising a textile of high-tenacity organic fibers, the fiber has a tenacity of not lower than 15 cN/dtex. In the textile, the high-tenacity organic fiber may have a single fiber fineness within the range between 0.3 dtex and 15 dtex, or a total fineness of within the range between 3 dtex and 3,000 dtex. The fiber may include, for example, a fully-aromatic polyester fiber.