The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2013
Filed:
Jun. 22, 2009
Applicants:
Kyunghoon Lee, Icheon, KR;
Daewook Yang, Pyoungtaek-si, KR;
Sunmi Kim, Gyangju-si, KR;
Inventors:
Assignee:
STATS Chippac Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/02 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a device having a conductor with ends exposed on opposite sides of the device; forming a first surface depression on the device around the conductor; connecting a first component over the conductor and surrounded by the first surface depression; and applying a first underfill between the first component and the device, the first underfill substantially filled within a perimeter of the first surface depression.