The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8416555 B1

PDF
Full Text
Expired
Date of Patent:
Apr. 09, 2013

Filed:

Jul. 25, 2011
Applicants:

Chung-tsung LU, Tainan, TW;

Pin-chia Su, Tainan, TW;

Yu-chih Liou, Tainan, TW;

Inventors:

Chung-Tsung Lu, Tainan, TW;

Pin-Chia Su, Tainan, TW;

Yu-Chih Liou, Tainan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01T 23/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A system for chucking and de-chucking a work piece comprises a wafer stage having a chuck support for supporting a chuck. The wafer stage further comprises a chuck mounted on the chuck support for receiving and attaching the work piece thereto; a support lift means for supporting the work piece; a driving means coupled to the support lift means for gradually raising the support lift means to contact the work piece in response to a variable quantity; a controller for receiving the variable quantity; and a regulating means coupled to the driving means and to the controller, the regulating means for controlling the variable quantity going to the driving means when a predetermined variable quantity is detected.


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Lu, Chung-Tsung. (2013). System for securely dechucking wafers (U.S. Patent No. 8416555). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8416555

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