The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 09, 2013

Filed:

May. 28, 2010
Applicants:

Shigenobu Sekine, Katsushika-ku, JP;

Yurina Sekine, Katsushika-ku, JP;

Yoshiharu Kuwana, Katsushika-ku, JP;

Ryuji Kimura, Katsushika-ku, JP;

Inventors:

Shigenobu Sekine, Katsushika-ku, JP;

Yurina Sekine, Katsushika-ku, JP;

Yoshiharu Kuwana, Katsushika-ku, JP;

Ryuji Kimura, Katsushika-ku, JP;

Assignee:

Napra Co., Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 21/768 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

An electronic device includes a plurality of stacked substrates. Each of the substrates includes a semiconductor substrate, a columnar conductor, and a ring-shaped insulator. The columnar conductor extends along a thickness direction of the semiconductor substrate. The ring-shaped insulator includes an inorganic insulating layer mainly composed of a glass. The inorganic insulating layer fills a ring-shaped groove that is provided in the semiconductor substrate to surround the columnar conductor.


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