The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 2013
Filed:
Dec. 23, 2010
Tien-kan Chung, Pingzhen, TW;
Chung-hsien Lin, Hsinchu, TW;
Yao-te Huang, Hsinchu, TW;
Chia-hua Chu, Zhubei, TW;
Chia-ming Hung, Taipei, TW;
Wen-chuan Tai, Dayuan Township, Taoyuan County, TW;
Chang-yi Yang, Hsinchu, TW;
Tien-Kan Chung, Pingzhen, TW;
Chung-Hsien Lin, Hsinchu, TW;
Yao-Te Huang, Hsinchu, TW;
Chia-Hua Chu, Zhubei, TW;
Chia-Ming Hung, Taipei, TW;
Wen-Chuan Tai, Dayuan Township, Taoyuan County, TW;
Chang-Yi Yang, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
The present disclosure provides a micro device. The device has a micro-electro-mechanical systems (MEMS) movable structure, a plurality of metal loops over the MEMS movable structure, and a piezoelectric element over the MEMS movable structure. Frontside and backside capping wafers are bonded to the MEMS structure, with the frontside and backside capping wafers encapsulating the MEMS movable structure, the plurality of metal loops, and the piezoelectric element. The device further includes a magnet disposed on the frontside capping wafer over the plurality of metal loops.