The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 26, 2013
Filed:
Jun. 17, 2010
Renata Camillo-castillo, Essex Junction, VT (US);
Mattias E. Dahlstrom, Burlington, VT (US);
Peter B. Gray, Jericho, VT (US);
David L. Harame, Essex Junction, VI (US);
Russell T. Herrin, Essex Junction, VT (US);
Alvin J. Joseph, Williston, VT (US);
Andreas D. Stricker, Essex Junction, VT (US);
Renata Camillo-Castillo, Essex Junction, VT (US);
Mattias E. Dahlstrom, Burlington, VT (US);
Peter B. Gray, Jericho, VT (US);
David L. Harame, Essex Junction, VI (US);
Russell T. Herrin, Essex Junction, VT (US);
Alvin J. Joseph, Williston, VT (US);
Andreas D. Stricker, Essex Junction, VT (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Disclosed are embodiments of an improved transistor structure (e.g., a bipolar transistor (BT) structure or heterojunction bipolar transistor (HBT) structure) and a method of forming the transistor structure. The structure embodiments can incorporate a dielectric layer sandwiched between an intrinsic base layer and a raised extrinsic base layer to reduce collector-base capacitance C, a sidewall-defined conductive strap for an intrinsic base layer to extrinsic base layer link-up region to reduce base resistance Rand a dielectric spacer between the extrinsic base layer and an emitter layer to reduce base-emitter Ccapacitance. The method embodiments allow for self-aligning of the emitter to base regions and further allow the geometries of different features (e.g., the thickness of the dielectric layer, the width of the conductive strap, the width of the dielectric spacer and the width of the emitter layer) to be selectively adjusted in order to optimize transistor performance.