The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 05, 2013
Filed:
Sep. 15, 2011
Yaojian Lin, Singapore, SG;
Haijing Cao, Singapore, SG;
Qing Zhang, Singapore, SG;
Stats Chippac Ltd., Singapore, SG;
Abstract
A method for manufacture of an integrated circuit package system includes: providing an integrated circuit die having a contact pad; forming a protection cover over the contact pad; forming a passivation layer having a first opening over the protection cover with the first opening exposing the protection cover; developing a conductive layer over the passivation layer; forming a pad opening in the protection cover for exposing the contact pad having the conductive layer partially removed; and an interconnect directly on the contact pad and only adjacent to the protection cover and the passivation layer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile