The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 05, 2013

Filed:

Apr. 02, 2010
Applicants:

Ru-shang Hsiao, Jhubei, TW;

Kun-yu Tsai, Taipei, TW;

Chien-hsien Tseng, Hsin-Chu, TW;

Shou-gwo Wuu, Hsin-Chu, TW;

Nai-wen Cheng, Tainan, TW;

Inventors:

Ru-Shang Hsiao, Jhubei, TW;

Kun-Yu Tsai, Taipei, TW;

Chien-Hsien Tseng, Hsin-Chu, TW;

Shou-Gwo Wuu, Hsin-Chu, TW;

Nai-Wen Cheng, Tainan, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/76 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present disclosure provides methods and apparatus for sensor element isolation in a backside illuminated image sensor. In one embodiment, a method of fabricating a semiconductor device includes providing a sensor layer having a frontside surface and a backside surface, forming a plurality of frontside trenches in the frontside surface of the sensor layer, and implanting oxygen into the sensor layer through the plurality of frontside trenches. The method further includes annealing the implanted oxygen to form a plurality of first silicon oxide blocks in the sensor layer, wherein each first silicon oxide block is disposed substantially adjacent a respective frontside trench to form an isolation feature. A semiconductor device fabricated by such a method is also disclosed.


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