The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 05, 2013
Filed:
Sep. 24, 2011
Juan A. Herbsommer, Schnecksville, PA (US);
Jonathan a Noquil, Bethlehem, PA (US);
Osvaldo J Lopez, Annandale, NJ (US);
Juan A. Herbsommer, Schnecksville, PA (US);
Jonathan A Noquil, Bethlehem, PA (US);
Osvaldo J Lopez, Annandale, NJ (US);
Ciclon Semiconductor Device Corp., Bethlehem, PA (US);
Abstract
A semiconductor die package includes: an assembly including a semiconductor die, a clip structure attached to an upper surface of the semiconductor die, and a heat sink attached to an upper surface of the clip structure; and a molding material partially encapsulating the assembly, wherein an upper surface of the heat sink is exposed through the molding material.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile