The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8377799 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 19, 2013

Filed:

Mar. 24, 2011
Applicants:

Shunpei Yamazaki, Tokyo, JP;

Toru Takayama, Kanagawa, JP;

Mizuho Sato, Kanagawa, JP;

Noriaki Uto, Kanagawa, JP;

Inventors:

Shunpei Yamazaki, Tokyo, JP;

Toru Takayama, Kanagawa, JP;

Mizuho Sato, Kanagawa, JP;

Noriaki Uto, Kanagawa, JP;

Assignee:

Semiconductor Energy Laboratory Co., Ltd., Atsugi-shi, Kanagawa-ken, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/30 (2006.01);
U.S. Cl.
CPC ...
Abstract

An object of the present invention is to provide an SOI substrate including a semiconductor layer which is efficiently planarized. A method for manufacturing an SOI substrate includes a step of irradiating a bond substrate with an accelerated ion to form an embrittlement region; a step of bonding the bond substrate and the base substrate with an insulating layer positioned therebetween; a step of splitting the bond substrate at the embrittlement region to leave a semiconductor layer bonded to the base substrate; a step of disposing the semiconductor layer in front of a semiconductor target containing the same semiconductor material as the semiconductor layer; and a step of alternately irradiating the surface of the semiconductor layer and the semiconductor target with a rare gas ion, so that the surface of the semiconductor layer is planarized.


Find Patent Forward Citations

Yamazaki, Shunpei. (2013). Method of manufacturing soi substrate (U.S. Patent No. 8377799). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8377799

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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