The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 19, 2013
Filed:
Jun. 06, 2011
Robert Rash, Portland, OR (US);
Shantinath Ghongadi, Wilsonville, OR (US);
Kousik Ganesan, Hillsboro, OR (US);
Zhian He, Beaverton, OR (US);
Tariq Majid, Wilsonville, OR (US);
Jeff Hawkins, Portland, OR (US);
Seshasayee Varadarajan, Lake Oswego, OR (US);
Bryan Buckalew, Tualatin, OR (US);
Robert Rash, Portland, OR (US);
Shantinath Ghongadi, Wilsonville, OR (US);
Kousik Ganesan, Hillsboro, OR (US);
Zhian He, Beaverton, OR (US);
Tariq Majid, Wilsonville, OR (US);
Jeff Hawkins, Portland, OR (US);
Seshasayee Varadarajan, Lake Oswego, OR (US);
Bryan Buckalew, Tualatin, OR (US);
Novellus Systems, Inc., San Jose, CA (US);
Abstract
Embodiments of a closed-contact electroplating cup are disclosed. One embodiment comprises a cup bottom comprising an opening, and a seal disposed on the cup bottom around the opening. The seal comprises a wafer-contacting peak located substantially at an inner edge of the seal. The embodiment also comprises an electrical contact structure disposed over a portion of the seal, wherein the electrical contact structure comprises an outer ring and a plurality of contacts extending inwardly from the outer ring, and wherein each contact has a generally flat wafer-contacting surface. The embodiment further comprises a wafer-centering mechanism configured to center a wafer in the cup.