The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 12, 2013

Filed:

Jun. 29, 2012
Applicants:

Mitsuaki Katagiri, Tokyo, JP;

Hisashi Tanie, Tokyo, JP;

Jun Kayamori, Tokyo, JP;

Dai Sasaki, Tokyo, JP;

Hiroshi Moriya, Tokyo, JP;

Inventors:

Mitsuaki Katagiri, Tokyo, JP;

Hisashi Tanie, Tokyo, JP;

Jun Kayamori, Tokyo, JP;

Dai Sasaki, Tokyo, JP;

Hiroshi Moriya, Tokyo, JP;

Assignee:

Elpida Memory, Inc., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 23/485 (2006.01); H01L 25/10 (2006.01);
U.S. Cl.
CPC ...
Abstract

In a stacked-type semiconductor device, a first semiconductor device and at least one second semiconductor device are stacked. The first semiconductor device includes a wiring board and a first semiconductor chip mounted on the wiring board. The second semiconductor device includes a wiring board and a second semiconductor chip mounted on the wiring board. The thickness of the second semiconductor chip of each second semiconductor device is thicker than the thickness of the first semiconductor chip.


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