The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 05, 2013
Filed:
Apr. 08, 2010
Chien-hsin Huang, Taichung, TW;
Li-che Chen, Pingtung, TW;
Ming-i Wang, Tucheng, TW;
Bang-chiang Lan, Taipei, TW;
Hui-min Wu, Zhubei, TW;
Tzung-i Su, Beigang Township, Yunlin County, TW;
Chien-Hsin Huang, Taichung, TW;
Li-Che Chen, Pingtung, TW;
Ming-I Wang, Tucheng, TW;
Bang-Chiang Lan, Taipei, TW;
Hui-Min Wu, Zhubei, TW;
Tzung-I Su, Beigang Township, Yunlin County, TW;
United Microelectronics Corp., Hsinchu, TW;
Abstract
A wafer level package of micro electromechanical system (MEMS) microphone includes a substrate, a number of dielectric layers stacked on the substrate, a MEMS diaphragm, a number of supporting rings and a protective layer. The MEMS diaphragm is disposed between two adjacent dielectric layers. A first chamber is between the MEMS diaphragm and the substrate. The supporting rings are disposed in some dielectric layers and stacked with each other. An inner diameter of the lower supporting ring is greater than that of the upper supporting ring. The protective layer is disposed on the upmost supporting ring and covers the MEMS diaphragm. A second chamber is between the MEMS diaphragm and the protective layer. The protective layer defines a number of first through holes for exposing the MEMS diaphragm. The wafer level package of MEMS microphone has an advantage of low cost.