The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 05, 2013
Filed:
Nov. 30, 2009
Robert F. Darveaux, Gilbert, AZ (US);
Christopher J. Berry, Chandler, AZ (US);
Robert F. Darveaux, Gilbert, AZ (US);
Christopher J. Berry, Chandler, AZ (US);
Amkor Technology, Inc., Chandler, AZ (US);
Abstract
A bend test method includes bending a flip chip device into a bent configuration, heating the flip chip device, and inspecting the flip chip device for failure. The bend test method is completed in a relatively short amount of time, e.g., within one to three days. Thus, appropriate failure modes in flip chip devices are created in an accelerated manner so that reliability assessment of various flip chip device designs, materials, and process options can be completed in a few days instead of a few months. This greatly reduced development cycle time typically results in a larger market share for new flip chip device products.