The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 29, 2013
Filed:
Oct. 12, 2005
Mitsuaki Katagiri, Chuo-ku, JP;
Hiroya Shimizu, Chiyoda-ku, JP;
Fumiyuki Osanai, Chuo-ku, JP;
Yasushi Takahashi, Chuo-ku, JP;
Seiji Narui, Chuo-ku, JP;
Mitsuaki Katagiri, Chuo-ku, JP;
Hiroya Shimizu, Chiyoda-ku, JP;
Fumiyuki Osanai, Chuo-ku, JP;
Yasushi Takahashi, Chuo-ku, JP;
Seiji Narui, Chuo-ku, JP;
Elpida Memory, Inc., Tokyo, JP;
Abstract
A semiconductor device has a semiconductor chip in which a plurality of semiconductor components and a plurality of pads are arranged, a plurality of external connection contacts arranged in grids, and a plurality of wires for electrically connecting the pads and the external connection contacts. The pads include a plurality of pad groups including a pair of electrode pads connected to the plurality of semiconductor components in common and a plurality of signal pads respectively connected to the semiconductor components connected to the electrode pads. In each pad group, each signal pad is arranged adjacently to one of the electrode pads; and each wire extending from each signal pad is extended along a wire extended from the electrode pad adjacent to each signal pad.