The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 15, 2013
Filed:
Jul. 31, 2007
Chu-chin HU, Hsin-chu, TW;
Shang-wei Chen, Hsin-chu, TW;
Chu-Chin Hu, Hsin-chu, TW;
Shang-Wei Chen, Hsin-chu, TW;
Unimicron Technology Corp., Taoyuan, TW;
Abstract
A circuit board structure with an embedded semiconductor chip and a fabrication method thereof are provided, including the steps of providing a semiconductor wafer having an active surface with a plurality of electrode pads, a connection metal layer formed on the electrode pads: forming a protective layer on the connection metal layer and the semiconductor wafer, performing a cutting process to form a plurality of semiconductor dies, providing a carrier board having at least one cavity for receiving the semiconductor chip; and forming sequentially on the protective layer covering the semiconductor chip and the carrier board a dielectric layer and a circuit layer electrically connected to the connection metal layer of the semiconductor chip. The present invention is a simple, in process and low in process cost, due to the connection metal layer covered by the protective layer formed on the semiconductor chip protected from oxidation and contamination.