The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 15, 2013

Filed:

Feb. 27, 2009
Applicants:

Yuichi Takenaga, Nirasaki, JP;

Wenling Wang, Nirasaki, JP;

Tatsuya Yamaguchi, Nirasaki, JP;

Masahiko Kaminishi, Oshu, JP;

Inventors:

Yuichi Takenaga, Nirasaki, JP;

Wenling Wang, Nirasaki, JP;

Tatsuya Yamaguchi, Nirasaki, JP;

Masahiko Kaminishi, Oshu, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/52 (2006.01); C23C 16/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

There are provided a thermal processing apparatus, a method for regulating a temperature of a thermal processing apparatus, and a program, by which a temperature can be easily regulated. A control partof a thermal processing apparatuscontrols the apparatus so as to deposit SiOfilms on semiconductor wafers W, and judges whether the SiOfilms satisfy an in-plane uniformity. When the in-plane uniformity is not judged to be satisfied, the control partcalculates a temperature of a preheating partby which temperature the in-plane uniformity can be satisfied. The control partcontrols the apparatus so as to deposit SiOfilms on semiconductor wafers W under process conditions in which the temperature of the preheating parthas been varied into the calculated temperature, and the temperature of the preheating partsis regulated. When the in-plane uniformity is judged to be satisfied, the control partregulates temperatures of heaterstoby the same procedure so as to satisfy an inter-plane uniformity.


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