The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 25, 2012
Filed:
Jul. 30, 2010
Ludovico E. Bancod, Chandler, AZ (US);
Jin Seong Kim, Seoul, KR;
Kurt Peter Wachtler, Richardson, TX (US);
Ludovico E. Bancod, Chandler, AZ (US);
Jin Seong Kim, Seoul, KR;
Kurt Peter Wachtler, Richardson, TX (US);
Amkor Technology, Inc., Chandler, AZ (US);
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
A method of forming a stackable plasma cleaned via package includes forming interconnection balls on terminals. The interconnection balls are encapsulated in a package body, e.g., molding compound. Via apertures are formed through the package body to expose the interconnection balls, wherein a contamination is formed on the interconnection balls. The contamination is removed using a plasma cleaning process. By removing the contamination, robust reflow of the interconnection balls is insured thus maximizing yield. Further, the plasma cleaning process is a cost efficient high volume process with no adverse effect on package reliability.