The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 25, 2012

Filed:

Nov. 27, 2007
Applicants:

Wei Zhang, Plainsboro, NJ (US);

Lin HU, Livingston, NJ (US);

Hua Tan, Princeton Junction, NJ (US);

He Gao, Plainsboro, NJ (US);

Linshu Kong, Plainsboro, NJ (US);

Stephen Y. Chou, Princeton, NJ (US);

Inventors:

Wei Zhang, Plainsboro, NJ (US);

Lin Hu, Livingston, NJ (US);

Hua Tan, Princeton Junction, NJ (US);

He Gao, Plainsboro, NJ (US);

Linshu Kong, Plainsboro, NJ (US);

Stephen Y. Chou, Princeton, NJ (US);

Assignee:

Nanonex Corporation, Monmouth Junction, NJ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05H 1/24 (2006.01); C23C 16/00 (2006.01); B05D 3/00 (2006.01); B05D 3/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

In imprint lithography, the mold is coated with a surface release layer for a non-sticking separation. Bonding strength of the release layer to the mold depends on the cleanness of the surface and the process of release layer deposition. In accordance with the invention, the mold is disposed in an evacuable chamber, cleaned to remove surface organic contamination and coated with the surface release layer in a chamber, all without relocation or undesired time delay. The chamber encloses a support chuck for the mold or substrate, a surface cleaner unit adjacent the support, a heating source adjacent the support, and advantageously, sensors of measuring chamber pressure, vapor partial pressure and moisture concentration. A vapor source connected to the chamber supplies release surfactant vapor. The mold is cleaned, and the cleaning is followed by vapor phase deposition of the surfactant. The mold is advantageously heated. Typical ways of cleaning include exposure to ozone or plasma ion etch. Surfactant vapor may be generated by liquid surface vaporization, liquid injection or spray vaporization. A surface adhesion promoter can be coated on the substrate by a similar method with the same apparatus.


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