The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 11, 2012
Filed:
Sep. 12, 2006
Tsuneo Torikoshi, Tokyo, JP;
Kuniaki Yamaguchi, Kumamoto, JP;
Tsuneo Torikoshi, Tokyo, JP;
Kuniaki Yamaguchi, Kumamoto, JP;
Ebara Corporation, Tokyo, JP;
Abstract
A polishing method can bring a polishing surface to the optimum condition for polishing, without using a dummy wafer, before resuming polishing, thereby eliminating the cost of dummy wafer. The polishing method includes carrying out a stand-by operation during a polishing-resting time period, carrying out a preparatory process to polishing, after completion of the stand-by operation, by dressing a polishing surface while supplying a polishing liquid to the polishing surface, and starting polishing of a workpiece after completion of the preparatory process to polishing. A determination as to whether to carry out the preparatory process to polishing after completion of the stand-by operation may be made based on the total operating time of the stand-by operation or the total effective number of the stand-by operations.