The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 11, 2012
Filed:
Nov. 18, 2010
Douglas A. Buchberger, Jr., Livermore, CA (US);
Paul Lukas Brillhart, Pleasanton, CA (US);
Richard Fovell, San Jose, CA (US);
Douglas H. Burns, Saratoga, CA (US);
Kallol Bera, San Jose, CA (US);
Daniel J. Hoffman, Saratoga, CA (US);
Kenneth W. Cowans, Fullerton, CA (US);
William W. Cowans, Fullerton, CA (US);
Glenn W. Zubillaga, Canyon Lake, CA (US);
Isaac Millan, Anaheim, CA (US);
Douglas A. Buchberger, Jr., Livermore, CA (US);
Paul Lukas Brillhart, Pleasanton, CA (US);
Richard Fovell, San Jose, CA (US);
Douglas H. Burns, Saratoga, CA (US);
Kallol Bera, San Jose, CA (US);
Daniel J. Hoffman, Saratoga, CA (US);
Kenneth W. Cowans, Fullerton, CA (US);
William W. Cowans, Fullerton, CA (US);
Glenn W. Zubillaga, Canyon Lake, CA (US);
Isaac Millan, Anaheim, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
B/E Aerospace, Inc., Wellington, FL (US);
Abstract
A method of processing a workpiece in a plasma reactor having an electrostatic chuck for supporting the workpiece within a reactor chamber, the method including circulating a coolant through a refrigeration loop that includes an evaporator inside the electrostatic chuck, while pressurizing a workpiece-to-chuck interface with a thermally conductive gas, sensing conditions in the chamber including temperature near the workpiece and simulating heat flow through the electrostatic chuck in a thermal model of the chuck based upon the conditions. The method further includes obtaining the next scheduled change in RF heat load on the workpiece and using the model to estimate a change in thermal conditions of the coolant in the evaporator that would hold the temperature nearly constant by compensating for the next scheduled change in RF heat load, and making the change in thermal conditions of the coolant in the evaporator prior to the time of the next scheduled change by a head start related to the thermal propagation delay through the electrostatic chuck.