The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 13, 2012
Filed:
Dec. 08, 2010
Richard Alfred Beaupre, Pittsfield, MA (US);
Paul Alan Mcconnelee, Albany, NY (US);
Arun Virupaksha Gowda, Rexford, NY (US);
Thomas Bert Gorczyca, Schenectady, NY (US);
Richard Alfred Beaupre, Pittsfield, MA (US);
Paul Alan McConnelee, Albany, NY (US);
Arun Virupaksha Gowda, Rexford, NY (US);
Thomas Bert Gorczyca, Schenectady, NY (US);
General Electric Company, Schenectady, NY (US);
Abstract
A semiconductor device package includes a semiconductor device having connection pads formed thereon, with the connection pads being formed on first and second surfaces of the semiconductor device with edges of the semiconductor device extending therebetween. A first passivation layer is applied on the semiconductor device and a base dielectric laminate is affixed to the first surface of the semiconductor device that has a thickness greater than that of the first passivation layer. A second passivation layer having a thickness greater than that of the first passivation layer is applied over the first passivation layer and the semiconductor device to cover the second surface and the edges of the semiconductor device, and metal interconnects are coupled to the connection pads, with the metal interconnects extending through vias formed through the first and second passivation layers and the base dielectric laminate sheet to form a connection with the connection pads.