The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 06, 2012

Filed:

Oct. 19, 2010
Applicants:

Chi-hao Chiu, Hsinchu, TW;

Ming-tsung Chen, Changhua County, TW;

Chiao-yinms Yang, Miaoli County, TW;

Inventors:

Chi-Hao Chiu, Hsinchu, TW;

Ming-Tsung Chen, Changhua County, TW;

Chiao-Yinms Yang, Miaoli County, TW;

Assignee:

Apaq Technology Co., Ltd., Miaoli County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 9/08 (2006.01);
U.S. Cl.
CPC ...
Abstract

An insulating encapsulation structure is applied to a chip type solid electrolytic capacitor that includes an aluminum metallic body having an aluminum core layer. An upper oxide film and a lower oxide film respectively having fine holes on their surfaces are respectively formed on the top and the bottom of the aluminum core layer. On side surfaces of the metallic body is a plurality of cut burrs. The upper oxide film and the lower oxide film of the metallic body are respectively separated by a separating layer to form an anode and a cathode. The insulating encapsulation structure includes an insulating cover layer enclosing an outer surface of the metallic body to cover the cut burrs. Thereby, the required chemical conversion process is reduced along with current leakage, the overall manufacturing cost is lowered, and the mechanical strength for the edge of the metallic body is reinforced.


Find Patent Forward Citations

Loading…