The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 06, 2012
Filed:
Jun. 08, 2011
Hyuek-jae Lee, Suwon-si, KR;
Ji-sun Hong, Asan-si, KR;
Tae-je Cho, Yongin-si, KR;
Jong-yun Myung, Seoul, KR;
Young-bok Kim, Asan-si, KR;
Hyung-sun Jang, Anyang-si, KR;
Eun-mi Kim, Yongin-si, KR;
Hyuek-Jae Lee, Suwon-si, KR;
Ji-Sun Hong, Asan-si, KR;
Tae-Je Cho, Yongin-si, KR;
Jong-Yun Myung, Seoul, KR;
Young-Bok Kim, Asan-si, KR;
Hyung-Sun Jang, Anyang-si, KR;
Eun-Mi Kim, Yongin-si, KR;
Abstract
A method of packaging a semiconductor device may include providing a semiconductor substrate including first and second spaced apart semiconductor chip areas, and adhering a cover on the first and second spaced apart semiconductor chip areas of the semiconductor substrate. A scribe line may be formed through the semiconductor substrate between the first and second semiconductor chip areas with a semiconductor bridge pattern remaining connected between the first and second spaced apart semiconductor chip areas after forming the scribe line. The cover and the semiconductor bridge pattern may then be cut after forming the scribe line.