The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 30, 2012
Filed:
Oct. 08, 2010
Applicants:
Chen-fa LU, Gangshan Township, TW;
Chiang-hao Lee, Changhua, TW;
Wei-yu Chen, Taipei, TW;
Chung-shi Liu, Shin-Chu, TW;
Inventors:
Chen-Fa Lu, Gangshan Township, TW;
Chiang-Hao Lee, Changhua, TW;
Wei-Yu Chen, Taipei, TW;
Chung-Shi Liu, Shin-Chu, TW;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 49/00 (2012.01); B24B 51/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
In a system or method for controlling wafer back-grinding, a chuck table has a surface for supporting a semiconductor wafer during a back-grinding process, one or more holes in the surface, and one or more sensors disposed in the one or more holes for monitoring a parameter during back-grinding. A computer-implemented process control tool is coupled to receive one or mote outputs from the one or more sensors and control the back-grinding process based on the received one or more outputs.