The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 23, 2012
Filed:
Oct. 12, 2007
Naoto Yoshinaga, Hofu, JP;
Yoshiharu Wakayama, Hofu, JP;
Satoshi Ibaraki, Osaka, JP;
Jun Shimomura, Hofu, JP;
Yoshimi Murage, Hofu, JP;
Niro Shiomi, Hofu, JP;
Yoshinobu Kodani, Hofu, JP;
Takaomi Ikeda, Hofu, JP;
Naoto Yoshinaga, Hofu, JP;
Yoshiharu Wakayama, Hofu, JP;
Satoshi Ibaraki, Osaka, JP;
Jun Shimomura, Hofu, JP;
Yoshimi Murage, Hofu, JP;
Niro Shiomi, Hofu, JP;
Yoshinobu Kodani, Hofu, JP;
Takaomi Ikeda, Hofu, JP;
Air Water Inc., Hokkaido, JP;
Abstract
Disclosed is a non-thermofusible phenol resin powder having an average particle diameter of not more than 20 μm and a single particle ratio of not less than 0.7. This non-thermofusible phenol resin powder preferably has a chlorine content of not more than 500 ppm. This non-thermofusible phenol resin powder is useful as an organic filler for sealing materials for semiconductors and adhesives for semiconductors. The non-thermofusible phenol resin powder is also useful as a precursor of functional carbon materials such as a molecular sieve carbon and a carbon electrode material.