The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 23, 2012
Filed:
Aug. 04, 2006
Applicants:
Dennis Guillermo, Singapore, SG;
Sheila Rima C. Magno, Singapore, SG;
Ma. Shirley Asoy, Singapore, SG;
Pandi Chelvam Marimuthu, Singapore, SG;
Inventors:
Dennis Guillermo, Singapore, SG;
Sheila Rima C. Magno, Singapore, SG;
Ma. Shirley Asoy, Singapore, SG;
Pandi Chelvam Marimuthu, Singapore, SG;
Assignee:
STATS ChipPAC Ltd., Singapore, SG;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
An integrated circuit package system is provided including forming a wafer having a back side and an active side, forming a recess in the wafer from the back side, forming a cover in the recess, and singulating the wafer at the recess filled with the cover.