The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8288665 B1

PDF
Full Text
Expired
Date of Patent:
Oct. 16, 2012

Filed:

Oct. 27, 2010
Applicants:

Motoo Asai, Ibi-gun, JP;

Dongdong Wang, Ibi-gun, JP;

Takahiro Mori, Ibi-gun, JP;

Inventors:

Motoo Asai, Ibi-gun, JP;

Dongdong Wang, Ibi-gun, JP;

Takahiro Mori, Ibi-gun, JP;

Assignee:

Ibiden Co., Ltd., Ogaki-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
Abstract

A multi-layer printed circuit board including a first insulating layer, a first conductor layer having conductor circuits on one surface of the first insulating layer, a second conductor layer having conductor circuits on the opposite surface of the first insulating layer, a second insulating layer on the second conductor and first insulating layers, and a third conductor layer having conductor circuits on the second insulating layer on the opposite side of the second conductor layer. The first and second insulating layers have first and second via holes which are formed in openings of the first and second insulating layers and made of conductive materials filled to the top of the openings such that conductor circuits in the first and third conductor layers are connected to one or more conductor circuits in the second conductor layer, and the first and second via holes are tapering toward the second conductor layer.


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Asai, Motoo. (2012). Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board (U.S. Patent No. 8288665). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8288665

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